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GSP7427-00
InGaP HBT Die

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Product Features
Product Details

0.01 ~ 6000 MHz
16 dB Gain @ 2 GHz
+26 dBm P1dB @ 2 GHz
+45 dBm OIP3 @ 2 GHz
External Matching Required
Bare Die

Data Sheet
Package Information CHIP
S-Parameters




Product Applications
PCB Layout and BOM Files

Mobile Infrastructure
Instrumentation
WiFi
WLAN

Not Applicable






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