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GSA606-00
InGaP HBT Die

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Product Features
Product Details

0.01 ~ 7000 MHz
15 dB Gain @ 2 GHz
+15.7 dBm P1dB @ 2 GHz
+28 dBm OIP3 @ 2 GHz
Internally matched to 50 Ohm
Bare Die

Data Sheet
Package Information CHIP
S-Parameters




Product Applications
PCB Layout and BOM Files

Mobile Infrastructure
RFID
Fiber Optic
Instrumentation
WiFi
WLAN

Not Applicable






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